AMD makes Instinct MI325X and MI355X official, MI400 coming next year
Dr. Lisa Su delivered updates during the “Advancing AI” event.
Today, AMD announced its new flagship series for data centers, the MI350. This product series includes two processors, the MI350 and MI355X. Both are based on the same silicon; however, the MI355X offers higher thermal and power characteristics, which allows for higher performance, confirms AMD CEO and President Dr. Lisa Su.
The MI350 series is built on a 3nm process node and features 185 billion transistors across 10 chiplets. AMD is using 2D hybrid bonding, with XCD chiplets manufactured using TSMC’s N3P process node, while the IOD chiplet uses the N6 node from the same fab.
MI350 Series, Source: AMD
The GPU now features 256 Compute Units (CDNA4), bringing the total core count to 16,384, a number that is actually lower than the MI325X, which had 19,456 cores. The CDNA4 architecture has been upgraded to support new FP4 and FP6 data types for AI inference. The new series also features a memory capacity of 288 GB, achieved through HBM3E technology operating at 8.0 TB/s.
MI350 Series, Source: AMD
AMD has focused on improving the energy efficiency of its new GPUs for data centers. However, to match competitors, AMD has pushed power consumption to 1000W for the MI350X and 1400W for the MI355X, using the new ODM form factor.
Instinct Roadmap and MI400, Source: AMD
The MI350 will be available starting in the third quarter. AMD has also confirmed its roadmap for the MI400, which will use the CDNA-Next architecture. This product will be released in 2026, according to AMD. The MI400 will feature increased memory capacity of 432 GB through HBM4 technology and more than double the bandwidth of the MI355X, reaching up to 19.6 TB/s.
| AMD Instinct Series (CDNA3+) | |||||
|---|---|---|---|---|---|
| AMD Instinct | Architecture | Cores GPU/CPU | Memory | Memory Bandwidth | Peak Power (TBP) |
| MI400🆕 | AMD CDNA-Next | TBC | 432GB HBM4 | 19.6 TB/s | TBC |
| MI355X 🆕 | AMD CDNA4 (N3P+N6) | 256/- | 288GB HBM3e | 8.0 TB/s | 1400W |
| MI350X 🆕 | AMD CDNA4 (N3P+N6) | 256/- | 288GB HBM3e | 8.0 TB/s | 1000W |
| MI325X | AMD CDNA 3 (N5+N6) | 304/- | 288GB HBM3e | 6.0 TB/s | 750+W |
| MI300A | AMD CDNA 3 (N5+N6) | 228/24 | 128GB HBM3 | 5.3 TB/s | 760W |
| MI300X | AMD CDNA 3 (N5+N6) | 304/- | 192GB HBM3 | 5.3 TB/s | 750W |
Source: AMD